
DS1339A
Low-Current, I2C, Serial Real-Time Clock
2
Maxim Integrated
Voltage Range on Any Pin Relative to Ground....-0.3V to +6.0V
Operating Temperature Range (Noncondensing)....-40NC to +85NC
Storage Temperature Range............................ -55NC to +125NC
Lead Temperature (soldering, 10 seconds) ...................+300NC
Soldering Temperature (reflow) ......................................+260NC
SOP
Junction-to-Ambient Thermal Resistance (BJA) .....206.3NC/W
Junction-to-Case Thermal Resistance (BJC) ...............42NC/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
RECOMMENDED OPERATING CONDITIONS
(TA = -40NC to +85NC, unless otherwise noted.) (Note 2)
DC ELECTRICAL CHARACTERISTICS
(VCC = MIN to MAX, VBACKUP = MIN to MAX, TA = -40NC to +85NC.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
VCC
1.71
3.3
5.5
V
Backup Supply Voltage
VBACKUP
1.3
3.0
3.7
V
VBACKMIN
1.15
1.3
Logic 1
VIH
0.7 x
VCC
5.5
V
Logic 0
VIL
-0.3
0.3 x
VCC
V
Power-Fail Voltage
VPF
1.51
1.61
1.71
V
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Input Leakage
ILI
(Note 3)
-0.1
0.1
F
A
I/O Leakage
ILO
(Note 4)
-0.1
0.1
F
A
Logic 0 Out (SDA or SQW/INT)
VOL = 0.4V,
VCC R VCCMIN
IOL
(Note 4)
3
mA
Logic 0 Out (SQW/INT)
VOL = 0.2V, VCC = 0V,
VBAT R VBATMIN
IOL
(Note 4)
250
F
A
VCC Active Current
ICCA
(Note 5)
450
F
A
VCC Standby Current
ICCS
(Note 6)
200
F
A
Trickle-Charger Resistor Register
10h = A5h, VCC = Typ,
VBACKUP = 0V
R1
(Note 7)
200
I